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Semiconductor Ceramics and Special Materials
PCD Diamond Substrate
Application： The PCD diamond substrate used for temperature conduction has the high temperature conductivity characteristics of diamond. Regulation：The material used in this product meets the requirement of the EU HSF regulation.
| 項次 | 項目 | 規格 |
| 1 | 材料 Material |
多晶鑽石 PCD |
| 2 | 尺寸 Size |
可客製化 限制 < 80mmx80mm |
| 3 | 厚度 Thickness |
可客製化 限制<10mm |
| 4 | 抗折強度 Bending Strength |
≧ 600 MPa |
| 5 | 楊氏模量 Young’s Modulus |
＞1220 GPa |
| 6 | 斷裂韌度 Fracture Toughness |
6.5 MPa･√m |
| 7 | 抗壓力強度 Compression strength |
8000 kg/cm2 |
| 8 | 熱傳導率 Thermal Conductivity |
≧ 1000 W/(m･K) |
| 9 | 熱膨脹係數 Coefficient of Thermal Expansion |
1.1 x 10-6/K |
| 10 | 介電常數 Dielectric Constant |
5.7 |
| 11 | 靜電放電 Electrostatic Discharge, ESD |
1016 Ω-cm |