Semiconductors-軒運科技有限公司-半導體設備廠商

Max Luck Technology Inc.

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半導體設備廠商TOP10-軒運科技有限公司
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Polycrystalline Diamond Wafer

Fourth-generation semiconductor materials

Polycrystalline Diamond Wafer

Semiconductor ceramics and special materials — PCD diamond substrates used for thermal conduction. PCD diamond wafers feature the high thermal conductivity properties of diamond. All raw materials used in this product comply with the EU HSF regulations.

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  Item Specification
1 Material PCD
2 Size Customizable.
8 / 12 inch
3 Thickness Customizable.
300um-775um
4 Bending Strength ≧ 600 MPa
5 Young’s Modulus ＞1220 GPa
6 Fracture Toughness 6.5 MPa･√m
7 Compression strength 8000 kg/cm2
8 Thermal Conductivity ≧ 800 W/(m･K)
9 Coefficient of
Thermal Expansion		 1.1 x 10-6/K
10 Dielectric Constant 5.7
11 Electrostatic Discharge, ESD 1016 Ω-cm