Wafer Thinning Machine-軒運科技有限公司-半導體設備廠商

Max Luck Technology Inc.


Wafer Thinning Machine

Semiconductor Equipment

Wafer Thinning Machine

The best choice for III-V brittle
and thin materials ~ Can be thinned to 30μm thickness


• Silicon Wafer
• GaAs, GaN
• InP, Ge, SiC

Soaking Function:
• Minimized Chemical Consumption
• Temperature Control Accuracy +1C
• Programable Soaking Time

Pressure Stripping:
• High Pressure Nozzle
• Aerodynamic Nozzle
• Steam Nozzle
• Backside Cushion
• (High Pressure Damage Free)
• Backside Clean

Final Clean & Dry:
• Double Side Clean
• Dry