Wafer Thinning Machine-軒運科技有限公司-半導體設備廠商

Max Luck Technology Inc.

半導體設備廠商TOP10-軒運科技有限公司

Wafer Thinning Machine

Semiconductor Equipment

Wafer Thinning Machine

The best choice for III-V brittle
and thin materials ~ Can be thinned to 30μm thickness
 

Introduction

Substrate:
• Silicon Wafer
• GaAs, GaN
• InP, Ge, SiC

Soaking Function:
• Minimized Chemical Consumption
• Temperature Control Accuracy +1C
• Programable Soaking Time

Pressure Stripping:
• High Pressure Nozzle
• Aerodynamic Nozzle
• Steam Nozzle
• Backside Cushion
• (High Pressure Damage Free)
• Backside Clean

Final Clean & Dry:
• Double Side Clean
• Dry

Information

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